Electronics Cooling & Thermal Management

At Hill Engineering we specialize in the thermal aspects of electronic product design. This includes matching fans or blowers to enclosure characteristics and thermal requirements, designing intake and exhaust grilles and louvers and placing internal components for optimum air flow paths. We also operate a testing laboratory to measure air flow and thermal performance of electronic enclosures.

If you are having thermal problems with an existing product, we can work with you to analyze your product, diagnose the problem, and recommend solutions. Turnaround time for this service can be as little as a few days.

To save even more time and help ensure reliability from the start, Hill Engineering can supplement your internal engineering staff during new product development by providing independent verification of the mechanical and thermal portions of the design.

We have a successful track record of practical solutions to electronic packaging and cooling problems that spans the past 20 years. We are currently serving major electronics companies nationwide. For more information, or to have a problem solved quickly, contact us at We can usually give you a quote and estimated delivery time the next day.

Here is a sampling of some of the services we can provide related to electronics cooling and thermal management.

  • Fan/blower selection

  • System resistance curves

  • Heat sink selection or design

  • Construction of low-cost flow mock-ups for early test and confirmation of cooling schemes

  • ANSI S12.11 sound chamber for measurement of noise emitted by small air-moving devices

  • Acoustic testing, design to reduce acoustic noise of systems

  • Prediction of thermal performance in all types of environments

  • Correlation of CFD analysis with test results more>>

  • Design of large transformers & inductors for forced air cooling

  • Prediction of temperature rise in products exposed to solar radiation

Product Design services>>